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2022 Product Releases & Updates

Cập nhật tính năng mới của Ansys 2022

Significant leaps in product design are driven by the ability to look at today’s challenges from different perspectives that bring together new ideas, experiences, and observed results. The latest products, technologies, and tools that makeup Ansys 2022 R2 enable experts to explore products and systems at a deep level under varying conditions to gain the insight needed to optimize their designs at every stage of the product development process. This insight is the catalyst for innovation and allows engineers to find answers where others cannot see past the challenges.

Ansys 2022 R2: 3D Design with Discovery 

Thiết kế 3D Ansys 3D Design 2022R1

Ansys Discovery 2022 R2 continues to expand simulation capabilities and ease of use for every engineer to unlock innovation and increase productivity throughout product development.

Customers in aerospace and defense, electronics, and the automotive industry will reach simulation through accelerated associative workflows for bolted connections, the addition of porous media modeling in Live Physics, and the availability of high-frequency electromagnetics within Discovery.

In addition, more analysts can now benefit from Ansys Discovery’s geometry preprocessing workflows, award-winning Live physics, and interactive user experience.

Ansys 2022 R2: Acoustic Simulation Updates

Mô phỏng âm học Ansys Acoustic 2022R1

Ansys Sound has improved capabilities specifically for the automotive and aerospace industries.

A new update in the Ansys Sound ASD for EV module allows users to export an entire Sound project, improving communication and hand-offs between manufacturers and suppliers to facilitate in-vehicle infotainment integration.

In addition, the Ansys Sound VRS module has enhanced sound quality for helicopter flight training simulators, enabling new sound sources to be achieved at known control points. Finally, updates to the Sound SAS module provide new representations and calculations for Power Spectral Density (PSD) and linear RMS values.

Ansys 2022 R2: Additive Manufacturing Update

Sản xuất bồi đắp - in 3D - Ansys Manufacturing 2022R1

Ansys 2022 R2 expands toolsets for Additive Manufacturing Users, streamlining your workflows between design, simulation, and manufacturing.

Every Ansys Mechanical User can now identify and minimize the risk for build errors and ensure high-quality parts through process simulation for Metal Laser Powder Bed Fusion (LPBF), Directed Energy Deposition (DED), and Metal Binder Jet (MBJ).

  • Workflow Improvements - Automatic Distortion Compensation is the ability to optimize a distortion compensated model within a simple automated workflow, which improves first-time print success.
  • Accuracy Enhancements - Consolidating additive technologies include Laser Power Bed Fusion (LPBF) scan pattern effects in Workbench Additive. With the consolidation of additive technologies, all users can rapidly increase simulation fidelity, capturing localized strain variations in each deposition layer.
  • Speed Performance - Introducing a Machine Learning (ML) model for predicting thermal strain can result in 10X time savings. Users can now easily explore the benefits of varying process setup parameters such as power, speed, and scan vector.

Ansys 2022 R2: Digital Twin Updates

Ansys Connect 2022R1

With Ansys 2022 R2 release, We continue to provide our customers with the right technology for accurate & evolving Digital Twins, with Twin Builder Hybrid Analytics and its new Fusion Modeling capability. Hybrid Analytics combines ML-based analytics with the physics-based approach to create the best possible Digital Twins and increase the digital twin accuracy up to 98%.

As part of Hybrid Analytics, Fusion Modeling capability allows users to accurately model the residual between model and prediction, allowing users to capture and include any remaining or missing physics into the digital twin.

The new release also includes powerful enhancements in ROM building process to better predict the accuracy of the ROMs with absolute and relative error estimates during the build process of Dynamic ROMs.

The new library Toshiba ACCU-ROM Toolkit makes designing Electric Power Steering (EPS) system easier, that enables fast simulation for both the electronic circuits and mechanical components.

Several enhancements to the Modelica UI are available in this new release, such as automatic connector sizing for array connections, support for Dialog and Final Annotation, and graphics improvements.


Ansys 2022 R2: Electronics Updates

Phần mềm mô phỏng chất lưu Ansys Fluids 2022R1

Ansys Electronics solutions continue to bring best-in-class technologies to address PCB, 3D IC package, EMI/EMC, thermal, cabling, and electromechanical design challenges with significant advancements in 5G, autonomous, and electrification simulation.

Ansys 2022 R2: Fluids Updates

Vật liệu mô phỏng Ansys Materials 2022R1

This release features major enhancements in the Fluids portfolio for more efficient and sustainable CFD simulations.

  • Substantially reduce simulation solve time and power consumption using the multi-GPU solver in Fluent with added support for transient flows including scale resolving simulation (SRS), non-confromal interfaces (NCI), and moving reference frames (MRF).
  • Automate processes, build custom workflows and craft customized solutions with PyFluent, opensource access to Fluent via Python.
  • Simulate production and consumption of hydrogen with a new proton exchange membrane (PEM) electrolysis model and validated hydrogen combustion models.
  • TurboGrid's automated hybrid meshing technology now supports complex blade tips, end-wall contouring and large blade root blends.
  • Model cavitation, phase change and leakage modeling in liquid pump and valve simulations using Forte. 
  • Performance enhancements using Rocky's particle assembly feature.

Ansys 2022 R2: Materials with Granta Updates

Mô phỏng kết cấu - Ansys Structure 2022 R1

2022 R2 sees Ansys Granta’s products build on the data, tool, and integration offering to help engineers factor in material sustainability earlier in the design process – helping reduce product development time and make more sustainable material choices.

Users of Ansys Mechanical can use the new Ansys Material Calibration app available in Granta MI™ to generate accurate material models from experimental data, to help drive simulation accuracy with materials across the simulation team.

With material now exportable from any Ansys Granta product to any Ansys flagship solver and a supercharged version of Granta MI Pro, we’re making it easier to take the first step to achieving Material Intelligence.

Ansys 2022 R2: Optics Updates

Mô phỏng điện - điện tử Ansys Electronisc 2022 R1

Ansys pushes the innovation envelope to deliver accurate, high-performance optical design and simulation capabilities for optical designers.

Speed design and boost accuracy with the latest Ansys Speos release. The 2022 R2 release delivers powerful capabilities that speed time to result, improve simulation accuracy, and expand interoperability with other Ansys products.

Link powerfully with CAD data thanks to a bi-directional link that eases the end user’s workflow by shortening the design iteration cycle.

2022 R2 brings the launch of Ansys Zemax OpticStudio, providing everything you need to simulate, optimize, and tolerance your optical designs. Design high-confidence virtual prototypes that you can thoroughly analyze before manufacturing.

With Ansys Zemax OpticsBuilder, design exceptional products efficiently and confidently deliver them to manufacturing. Empower engineers to work together on a single, shared file across optical and mechanical teams. Analyze the performance of optomechanical packaging and create optical drawings with a single click.

The 2022 R2 release of Ansys Lumerical introduces powerful new capabilities to extend usability, accuracy, performance, and functionality. These new features enhance modeling capabilities for electro-optical devices, from SPADs to microLEDs and lasers, and empower photonic integrated circuit (PIC) designers with capabilities for process-aware design and electronic-photonic design automation (EPDA).

Ansys 2022 R2: Photonics Updates

Mô phỏng kết cấu - Ansys Structure 2022 R1

The 2022 R2 release of Ansys Lumerical introduces a series of powerful new capabilities to extend usability, accuracy, performance, and functionality across its family of products.

  • Developments to optical solver cores and HPC performances
  • New workflows for modeling a variety of sub-wavelength structures in Lumerical optical solvers and then optimizing the macro-scale design in Zemax to see how it looks to a human using Speos
  • Improved simulation workflows for EAMs and LEDs with multi-quantum wells, as well as for single-photon avalanche photodetectors
  • Streamlined design of photonic devices and circuits by using the new capabilities in our process-aware custom component design flow and EPDA flow
  • Advancements to INTERCONNECT and Photonic Verilog-A models generated by CML Compiler
  • New INTERCONNECT solver for modeling quantum behavior in photonic integrated circuits

Ansys 2022 R2: Structures Updates

Mô phỏng điện - điện tử Ansys Electronisc 2022 R1

In 2022 R2, the Ansys Structures product line continues to improve integrations between products, materials databases, and advanced workflows with co-simulation capabilities and new APIs.

In this release, significant updates include:

  • Access multipurpose workflows quickly and efficiently with a new intuitively designed and customizable toolbar for Ansys Mechanical. The toolbar includes 14 add-ons, including the NVH Toolkit, DesignLife Fatigue, and Bolt Tools.
  • New functionality within Ansys Sherlock enables users to export PCB thermal results from Ansys Icepak and structural results from Ansys LS-DYNA into Sherlock for component lifetime predictions, enabling a more advanced closed-loop reliability workflow.
  • An automated co-simulation workflow with Ansys Motion and Ansys Maxwell solves the details of electromagnetic fields and kinematics associated with moving magnets for advanced magnetic latching capabilities.

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